Electroplated nickel gold is more normally utilized on IC substrates (for example PBGA), mostly for binding gold wires and copper wires; but when electroplating C substrates, extra conductive wires have to be manufactured with the gold finger binding position just before electroplating. To use circuits on either side, there have https://16-layer3-levelhdipcb73715.izrablog.com/31779209/examine-this-report-on-8-layer-first-order-pcb